Tin Solder Paste
35g Lead-Free Solder Paste For Electronics 138 ℃ Melting Point Sn42 Bi58 with Syringe - Low Residue Solder Cream for BGA and PCB Reflow
Item No.: 35G-138Sn42Bi58
Composition: Sn=42%, Bi=58%
Lead-free, Pb-free
Melting Point: 138℃
Microns: 20~38um
Suitable for the special soldering of
heat-sensitive PCB boards and small components
Net Weight: 35g/Syringe (Tube)
Gross Weight:45g
Lead-free, Pb-free
Melting Point: 138℃
Microns: 20~38um
Suitable for the special soldering of
heat-sensitive PCB boards and small components
Net Weight: 35g/Syringe (Tube)
Gross Weight:45g
Description
Lead-Free Solder Paste For Electronics 138 ℃ Melting Point Sn42 Bi58 with Syringe - Low Residue Solder Cream for BGA and PCB Reflow
Item Number :35G-138Sn42Bi58
Composition: Sn=42%, Bi=58%
Lead-free, Pb-free
Melting Point: 138℃
Microns: 20~38um
Net Weight: 35g/Syringe (Tube)
Gross Weight:45g
Features:
Lead-free process
Low temperature requirement
Easy to operate
Applications
Suitable for the special soldering of
heat-sensitive PCB boards and small components
• Rotate counterclockwise to remove the syringe cap.
• Rotate clockwise to attach the needle.
• Smooth extrusion
• Fine texture
• Produced with professional formula
• Vacuum automatic mixing
