BGA reballing / IC reballing is a common repair work for damaged chips and solder balls on PCB. Required supplies: bga balls, solder ball, solderball, solder spheres, solder bga, bga solder balls, solder balls bga, reballing solder, bga stencil, reballing stencil, solder flux, solder cream, solder paste, BGA soldering station.
Step 1 Clean chip pads Remove old solder with desoldering wick from the BGA chip. Clean pads thoroughly, no leftover old solder or oxidation.
Step 2 Apply solder flux & solder paste Spread a thin layer of solder flux, then apply small amount of solder paste / solder cream on clean pads. The paste holds solder balls during heating.
Step 3 Align bga stencil / reballing stencil Lock the reballing stencil precisely above chip, make every stencil hole match one pad. Misalignment will cause bad reballing solder results.
Step 4 Place bga solder balls / solder spheres Scatter bga balls or solder ball over the stencil. Shake gently so solderball drops into each hole. Sweep away extra solder balls bga.
Step 5 Reflow on BGA soldering station Put the whole assembly on BGA soldering station for reflow heating. Solder flux helps melting, surface tension forms round solder spheres, balls stick firmly to pads.
Step 6 Cool & inspect Natural cooling. Clean residual flux. Check all bga solder balls: no missing, shifted or cold‑soldered balls. Now your solder bga chip is ready for re‑mounting onto PCB.
