Composition: Sn=62.8%, Pb=36.8%, Ag=0.4%
Leaded Solder Paste, silver-containing
Melting Point: 181℃
Microns: 20~38um
Net Weight: 35g/Syringe (Tube)
Gross Weight:45g
Suitable for high-temperature resistant double-sided fiber glass PCBs and SMT reflow
Composition: Sn=96.5%, Ag=3.0%, Cu=0.5%
Lead-free, Pb-free, silver-containing
Melting Point: 217℃
Microns: 20~38um
Net Weight: 35g/Syringe (Tube)
Gross Weight:45g
Suitable for soldering of fine-pitch ICs and various high-demand circuit boards
Model:NC-559-ASM
Quality Level: Common
Net Weight: 100g
Gross Weight :110g
Images are for reference only.
We will deliver products marked with the latest production date when shipping.
Model:NC-559-ASM
Quality Level: Common
Volume: 30cc
G.W.:40g
Images are for reference only.
We will deliver products marked with the latest production date when shipping.
Model:RMA-223
Quality Level: Common
Volume: 30cc
G.W.:40g
Images are for reference only.
We will deliver products marked with the latest production date when shipping.
Brand:KINGBO
Model:RMA-218
Weight: 100g
Images are for reference only.
We will deliver products marked with the latest production date when shipping.
Brand: MECHANIC Tin Paste
Leaded Solder Paste
Model: XG-50
Weight: 35g
Low Temperature 183°C Tin Solder Paste
Alloy: Sn63/Pb37
Material: Cu 99.98%
Length/Roll: 30 meter
Width: 3mm ~ 380mm (Customizable Cutting)
Single Side Conductive
Temperature Resistance:－10℃ to 130℃
Contact us
E-mail: zhiesync@gmail.com
Aluminum Foil Adhesive Tape
Length/Roll: 40M
Width: 40MM / 1.57 inch
Thickness:0.05MM
G.W.: 0.3KG
Contact us
E-mail: zhiesync@gmail.com
What'sApp : 0086 18665889453
Material:High-quality aluminum alloy
Compact structure and durable.
Suitable for stencil size: 80*80mm, and 90*90mm
Dimensions: 9x8x3 cm
G.W.: 340g
E-mail: zhiesync@gmail.com
Quick Positioning, with magnetically attach, with locking pins
Supported chip range: 4mm~45mm
Suitable for stencil size: 80*80mm, and 90*90mm
G.W.: 635g
E-mail: zhiesync@gmail.com
Brand: ACHI
Model: IR 6500
BGA Rework Station
Heating Mode: Infrared
Total Power: 1250W
Size of upper heating:80*80mm
Size of bottom heating:80mm*180mm
PCB board: Max. 400*305 mm
BGA chip size:Max. 70*70 mm
Weight:16kg
Package Size: 47*47*46cm
