Solder Paste & Solder Flux
Kingbo RMA-218 100g Solder Flux BGA Reflow Reballing Solder Paste For PCB Phone Repair High-viscosity No-clean Flux
Item No.: 100G-KINGBOO-218
Brand:KINGBO
Model:RMA-218
Weight: 100g
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Kingbo RMA-218 100g Solder Flux BGA Reflow Reballing Solder Paste For PCB Phone Repair High-viscosity No-clean Flux
Brand:KINGBO
Model:RMA-218
Weight: 100g
Features:Kingbo RMA-218 100g is a high-viscosity no-clean flux that can be used for rework, fixing balls or pins on for BGA, CGA and CSP packages, and for mounting flip-chips on PWB substrates.
A good formulation of for BGA ball/ball can make the ball more adherent.
It can be refluxed in hot air, infrared, oven or nitrogen environment. After reflow, 100 grams of Kingbo RMA-218 flux can leave bright solder joints.
High viscosity value and long viscosity life.
