Tin Solder Paste
Leaded Solder Paste Sn62.8 Pb36.8 Ag 0.4 181℃ Melting Point 35g Tin Solder Scream With Syringe And Needle
Item No.: 35G-181Sn62.8Pb36.8Ag0.4
Composition: Sn=62.8%, Pb=36.8%, Ag=0.4%
Leaded Solder Paste, silver-containing
Melting Point: 181℃
Microns: 20~38um
Net Weight: 35g/Syringe (Tube)
Gross Weight:45g
Suitable for high-temperature resistant double-sided fiber glass PCBs and SMT reflow
Leaded Solder Paste, silver-containing
Melting Point: 181℃
Microns: 20~38um
Net Weight: 35g/Syringe (Tube)
Gross Weight:45g
Suitable for high-temperature resistant double-sided fiber glass PCBs and SMT reflow
Description
Leaded Solder Paste Sn62.8 Pb36.8 Ag 0.4 181℃ Melting Point 35g Tin Solder Scream With Syringe And Needle- Low Residue Solder Cream for BGA and PCB Reflow
Composition: Sn=62.8%, Pb=36.8%, Ag=0.4%
Leaded Solder Paste, silver-containing
Melting Point: 181℃
Microns: 20~38um
Net Weight: 35g/Syringe (Tube)
Gross Weight:45g
Features:
High versatility
High electrical conductivity
Strong soldering joint
Bright solder joints
Applications:
Suitable for soldering of fine-pitch ICs, BGA solder ball planting in mobile phone repair, and soldering of various high-demand circuit boards
• Rotate counterclockwise to remove the syringe cap.
• Rotate clockwise to attach the needle.
• Smooth extrusion
• Fine texture
• Produced with professional formula
• Vacuum automatic mixing
