Tin Solder Paste
Leaded Solder Paste Sn63 Pb37 183℃ Melting Point 35g Tin Solder Scream With Syringe And Needle
Item No.: 35G-183Sn63Pb37
Composition: Sn=63%, Pb=37%
Leaded Solder Paste
Melting Point: 183℃
Microns: 20~38um
Net Weight: 35g/Syringe (Tube)
Gross Weight:45g
Suitable for soldering of fine-pitch ICs and various high-demand circuit boards
Leaded Solder Paste
Melting Point: 183℃
Microns: 20~38um
Net Weight: 35g/Syringe (Tube)
Gross Weight:45g
Suitable for soldering of fine-pitch ICs and various high-demand circuit boards
Description
Leaded Solder Paste Sn63 Pb37 183℃ Melting Point 35g Tin Solder Scream With Syringe And Needle- Low Residue Solder Cream for BGA and PCB Reflow
Composition: Sn=63%, Pb=37%
Leaded Solder Paste
Melting Point: 183℃
Microns: 20~38um
Net Weight: 35g/Syringe (Tube)
Gross Weight:45g
Features:
High versatility
High electrical conductivity
Strong soldering joint
Bright solder joints
Applications:
Suitable for soldering of fine-pitch ICs and various high-demand circuit boards
• Rotate counterclockwise to remove the syringe cap.
• Rotate clockwise to attach the needle.
• Smooth extrusion
• Fine texture
• Produced with professional formula
• Vacuum automatic mixing
