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0086 18665889453
No. 117 Guanlan Road, Longhua district ,Shenzhen, China
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MECHANIC XG-40 30g Tin Paste Low Temperature 183°C Tinning Paste Tin Solder Paste For Phone Repair, iPhone IC CPU SMD SMT BGA Soldering
Brand: MECHANIC Tin Paste Leaded Solder Paste Model: XG-40 Weight: 30g Low Temperature 183°C Tin Solder Paste Alloy: Sn63/Pb37
MECHANIC XG-30 16g Low Temperature 183°C Tin Paste,Tinning Paste Tin Solder Paste For Phone Repair, iPhone IC CPU SMD SMT BGA Soldering
Brand: MECHANIC Tin Paste Leaded Solder Paste Model: XG30 Weight: 16g Low Temperature 183°C Tin Solder Paste Alloy: Sn63/Pb37
Double Sided Copper Tape Conductive Adhesive Tape Copper 30M Length 3mm~380mm Width  EMI DIY Circuit Electrical Repair
Material: Cu 99.98% Length/Roll: 30 meter Width: 3mm ~ 380mm (Customizable Cutting) Double Side Conductive Temperature Resistance:-10℃ to 130℃ Contact us E-mail: zhiesync@gmail.com
Copper Tape Foil With Single Sided Conductive Adhesive Tape Copper 30M Length 3mm~380mm Width  EMI DIY Circuit Electrical Repair
Material: Cu 99.98% Length/Roll: 30 meter Width: 3mm ~ 380mm (Customizable Cutting) Single Side Conductive Temperature Resistance:-10℃ to 130℃ Contact us E-mail: zhiesync@gmail.com
Aluminum Foil Adhesive Tape 30mm Width, 40m Length Roll Heat Resistant Aluminum Tape For Use In Rework Process
Aluminum Foil Adhesive Tape Length/Roll: 40M Width: 30MM /1.18 inch Thickness:0.05MM G.W.: 0.24KG Contact us E-mail: zhiesync@gmail.com What'sApp : 0086 18665889453
Aluminum Alloy 90mm Silver BGA Reballing Station Kit With Allen Key For PCB Chip Soldering Rework Repair IC Reballing Jig
Material:High-quality aluminum alloy Compact structure and durable. Suitable for stencil size: 80*80mm, and 90*90mm Dimensions: 9x8x3 cm G.W.: 340g E-mail: zhiesync@gmail.com
80*80mm 90*90mm BGA Reballing Station Auto Magnet Solder Ball Stencil Holder IC Reballing Repair Tools
Quick Positioning, with magnetically attach, with locking pins Supported chip range: 4mm~45mm Suitable for stencil size: 80*80mm, and 90*90mm G.W.: 635g E-mail: zhiesync@gmail.com
ACHI IR 6500 BGA Machine Infrared BGA Rework Station for Motherboard Chip PCB Refurbished Repair BGA Rework Equipment
Brand: ACHI Model: IR 6500 BGA Rework Station Heating Mode: Infrared Total Power: 1250W Size of upper heating:80*80mm Size of bottom heating:80mm*180mm PCB board: Max. 400*305 mm BGA chip size:Max. 70*70 mm Weight:16kg Package Size: 47*47*46cm
ACHI IR PRO SC BGA Machine Infrared BGA Rework Station for Motherboard Chip PCB Refurbished Repair BGA Rework Equipment
Brand: ACHI Model: IR PRO SC BGA Rework Station Heating Mode: Infrared Size of upper heating:80*80mm Size of bottom heating:260mm*245mm Maximum PCB board: 450x300mm Weight:28 kg Package Size: 60X60X52cm
90*90mm Blue BGA Reballing Station Solder Ball Repair Tools Reballing Repair Stencil Soldering Station Kits
Use of aluminum alloy structure, compact structure and durable. G.W.: 393g
Professional Optical Vision Alignment Automatic BGA Rework Station for Efficient BGA Chip and Motherboard Rework
• Software in Engish • Heating method: Hot air + infrared • Vision alignment: Beam splitter prism positioning • Component types & range: All SMD electronic components (desoldering and soldering)
Kapton Tape 45mm Width Polyimide Heat Resistant Adhesive Tape 33M Length High Heat Tape Kapton Tape
Heat Resistant Adhesive Kapton Tape Length/Roll: 33M Width: 45MM Thickness:0.05MM Heat resistance: -260℃ To +300℃ G.W.: 0.16KG ROHS Certificated Contact us for price list: E-mail: zhiesync@gmail.com What'sApp : 0086 18665889453
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