Tin Solder Paste
Solder Paste Sn96.5 Ag3.0 Cu0.5 Lead-Free 217 ℃ Melting Point 35g Tin Solder Scream With Syringe
Item No.: 35G-217Sn96.5 Ag3.0 Cu0.5
Composition: Sn=96.5%, Ag=3.0%, Cu=0.5%
Lead-free, Pb-free, silver-containing
Melting Point: 217℃
Microns: 20~38um
Net Weight: 35g/Syringe (Tube)
Gross Weight:45g
Suitable for soldering of fine-pitch ICs and various high-demand circuit boards
Lead-free, Pb-free, silver-containing
Melting Point: 217℃
Microns: 20~38um
Net Weight: 35g/Syringe (Tube)
Gross Weight:45g
Suitable for soldering of fine-pitch ICs and various high-demand circuit boards
Description
Solder Paste Sn96.5 Ag3.0 Cu0.5 Lead-Free 217 ℃ Melting Point 35g Tin Solder Scream With Syringe - Low Residue Solder Cream for BGA and PCB Reflow
Composition: Sn=96.5%, Ag=3.0%, Cu=0.5%
Lead-free, Pb-free, silver-containing
Melting Point: 217℃
Microns: 20~38um
Net Weight: 35g/Syringe (Tube)
Gross Weight:45g
Features:
Strong soldering joint
High electrical conductivity
Strong oxidation resistance
Applications:
Suitable for soldering of fine-pitch ICs and various high-demand circuit boards
• Rotate counterclockwise to remove the syringe cap.
• Rotate clockwise to attach the needle.
• Smooth extrusion
• Fine texture
• Produced with professional formula
• Vacuum automatic mixing
