Tin Solder Paste
Solder Paste Sn99 Ag0.3 Cu0.7 Lead-Free 227 ℃ Melting Point 35g Tin Solder Scream With Syringe
Item No.: 35G-227Sn99Ag0.3Cu0.7
Composition: Sn=99%, Ag=0.3%, Cu=0.7%
Lead-free, Pb-free, silver-containing
Melting Point: 227℃
Microns: 20~38um
Net Weight: 35g/Syringe (Tube)
Gross Weight:45g
Suitable for high-temperature resistant double-sided fiber glass PCBs and SMT reflow so
Lead-free, Pb-free, silver-containing
Melting Point: 227℃
Microns: 20~38um
Net Weight: 35g/Syringe (Tube)
Gross Weight:45g
Suitable for high-temperature resistant double-sided fiber glass PCBs and SMT reflow so
Description
Solder Paste Sn99 Ag0.3 Cu0.7 Lead-Free 227 ℃ Melting Point 35g Tin Solder Scream With Syringe- Low Residue Solder Cream for BGA and PCB Reflow
Composition: Sn=99%, Ag=0.3%, Cu=0.7%
Lead-free, Pb-free, silver-containing
Melting Point: 227℃
Microns: 20~38um
Net Weight: 35g/Syringe (Tube)
Gross Weight:45g
Features:
Strong soldering joint
High electrical conductivity
Strong oxidation resistance
Applications:
Suitable for soldering of fine-pitch ICs and various high-demand circuit boards
Suitable for soldering of high-temperature resistant double-sided fiber glass PCBs and SMT (Surface Mount Technology) reflow soldering
• Rotate counterclockwise to remove the syringe cap.
• Rotate clockwise to attach the needle.
• Smooth extrusion
• Fine texture
• Produced with professional formula
• Vacuum automatic mixing
