• Software in Engish
• Heating method: Hot air + infrared
• Vision alignment: Beam splitter prism positioning
• Component types & range: All SMD electronic components (desoldering and soldering)
Rated Capacity:MAX 5300W
Dimensions:L650*W630*H850mm
Available BGA Chip:Max 70*70mm Min 1*1 mm
Available PCB size:Max 410*380mm Min 10*10 mm
Contact us for price list:
E-mail: zhiesync@gmail.com
What'sApp : 0086 18665889453