Professional Optical Vision Alignment Automatic BGA Rework Station for Efficient BGA Chip and Motherboard Rework  

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• Software in Engish
• Max PCB size: 460×380mm
• Heating method: Hot air + infrared
• Vision alignment: Beam splitter prism positioning
• Component types & range: All SMD electronic components (desoldering and soldering)
• Max BGA size: 60×60mm
• Max BGA ball count: Unlimited
• Min BGA ball pitch: 0.15mm
• Thermocouple quantity: 3
• Gross weight: 70KG
• Package dimensions: 740×710×1050mm

Introductions:
● Independent three-temperature zone temperature control system:
① The upper and lower temperature zones are heated by hot air, and the IR preheating zone is heated by infrared. The temperature is precisely controlled within ±2℃. The upper and lower temperature zones can heat simultaneously from the top of the components and the bottom of the PCB. It can be set with 8-segment temperature control, ensuring uniform heating of the PCB. The large-scale IR bottom preheating equalizes the temperature of the entire PCB, preventing deformation and ensuring the soldering effect. The heating plate can be independently controlled for heating.
② It can perform local hot air heating on the BGA chip and the PCB simultaneously. In addition, a large-area infrared heater is used to preheat the bottom of the PCB, completely avoiding the deformation of the PCB during the repair process. By selection, the upper or lower temperature zone can be used alone, and the energy of the upper and lower heating elements can be freely combined.
③ It uses a high-precision K-type thermocouple closed-loop control and a PID parameter self-tuning system. It can display four temperature curves simultaneously, store multiple groups of user data, and has an instant curve analysis function. The external temperature measurement interface enables precise detection of the temperature, and the temperature curve of the actually collected BGA can be analyzed and calibrated at any time. The curve analysis, setting, and correction of temperature parameters can be carried out on the touch screen at any time.
● Precise optical alignment system: It adopts a high-definition adjustable CCD color optical vision alignment system, with functions such as light splitting, magnification, reduction, and automatic focusing. It is equipped with an automatic color difference resolution and brightness adjustment device, which can adjust the imaging clarity, and is equipped with a 15-inch high-definition liquid crystal display.
● Multifunctional and user-friendly operating system:
① It adopts a high-definition touch screen human-machine interface, and the upper heating device and the mounting head are integrated in design. It is equipped with various specifications of titanium alloy BGA air nozzles, which can rotate 360° arbitrarily and are easy to install and replace.
② The X, Y axes and the R angle are finely adjusted with a micrometer, achieving precise alignment with an accuracy of up to ±0.01mm.
● Superior functions:
① It has 4 working modes, namely: disassembly, soldering, mounting, and semi-automatic modes.
② The wind speed can be adjusted in percentage, and the fan speed and the chip temperature curve are saved simultaneously.
③ The upper heating head is driven by a slide rail, with higher movement precision